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Forming component leads is an integral technological process at each installation site. More than 50% of lead components (DIP components) require forming before manual assembly, and more than 80% before the selective soldering process. There are several reasons for the need for this operation:
- Horizontal installation of axial components (resistors, diodes, etc.). Requires "U" molding.
- Vertical installation of axial components. Fountain molding of the leads is required.
- Installation of radial (capacitors, LEDs, etc.) components to a certain height. The leads need to be formed using a ZIG lock.
- Horizontal installation of radial components. Requires 90 degree molding of leads.
- Installation of components in a selective soldering plant. Requires 90 degree molding of leads and a ZIG lock.
Forming the leads of axial components
Automation of the process of forming the leads of axial components is the simplest. This is due to the symmetrical geometry of the location of the leads - it is easier to feed them into the molding installation (if the components are made of tape, then when the tape is pulled, the leads do not deform). It is for this reason that there are a large number of installations for this type of radio elements on the market.
There are two basic types of axial lead molding: "U" type molding and "f" (fountain) type molding. It is also possible to add a ZIG lock, which will allow the components to be firmly installed in the hole of the printed circuit board. The operations of forming the leads and forming the ZIG lock can be combined in one installation, or divided into two operations. The image below shows one example of equipment selection.
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INTERSTATE STANDARD
FORMING TERMS AND INSTALLING ELECTRONIC PRODUCTS ON PRINTED BOARDS
GENERAL REQUIREMENTS AND DESIGN STANDARDS
Official publication
IPC PUBLISHING HOUSE OF STANDARDS Moscow
INTERSTATE STANDARD
FORMING LEADINGS AND INSTALLING ELECTRONIC EQUIPMENT PRODUCTS ON PRINTED BOARDS
General requirements and design standards
Lead forming and electronic component insertion onto PC boards. General requirements and design specifications
Date of introduction 01/01/93
This standard applies to the formation of leads and installation of electronic equipment (hereinafter referred to as IEP) on printed circuit boards.
The standard establishes general requirements and design standards for forming leads and installing IET on printed circuit boards during the design and production of radio electronic devices (RES).
The requirements established by this standard are recommended.
The standard does not apply to the molding of IET leads molded by the IET manufacturer, or to the installation of IET in microwave equipment.
Terms used in the standard and their explanations - according to GOST 20406 and Appendix 1.
1. GENERAL REQUIREMENTS
1.1. IET intended for automated assembly of equipment must meet the requirements of regulatory and technical documentation.
1.2. Printed circuit boards intended for installation of electrical equipment must meet the requirements of the design documentation (CD) for them and GOST 23752.
1.3. For each IET pin installed on the board, a separate mounting hole or pad must be provided.
Reproduction is prohibited
It is allowed to install in a hole reinforced with PT type fittings according to GOST 22318, no more than two IET outputs.
Official publication
© Standards Publishing House, 1992 © IPK Standards Publishing House, 2004
mounting holes of the printed circuit board, it is necessary to provide one of the following types of their fastening:
1) forming leads using a zig, zig-lock or lock;
2) bending the leads on the back side of the board;
3) flattening the pins on the back side of the board;
4) bending of special fixing elements provided in the design of the IET body;
5) fastening with glue, except for options for and. 2.8.
2.10. When installing IET corresponding to 14-16, 18 standard design according to table. 1 (hereinafter referred to as IET execution...) according to options 140, 150, 160, 180, and IET execution 22 according to option 220, to ensure a gap between the IET body and the printed circuit board, technological gaskets should be used, forming the leads using a support zig and zig- castle
2.11. Calculation of dimensions for forming leads using a zig, zig-lock or lock is given in Appendix 2.
2.12. The IET leads bent on the back side of the board should not extend beyond the contact pads, and the length of the bent end of the lead should be at least 2 mm for boards with non-metallized mounting holes.
It is allowed for bent IET leads to extend beyond the contact pads while ensuring the distance between the adjacent printed conductor and the lead in accordance with GOST 23751.
2.13. The terminals of IETs with a diameter of more than 0.7 mm, as well as the terminals of multi-terminal and selectable IETs, are not bent. For multi-terminal IETs, it is allowed to bend two diagonally opposite terminals in the absence of corresponding restrictions in the specifications.
In technically justified cases, bending of leads with a diameter of more than 0.7 mm is allowed.
2.14. The height of the protruding ends of the leads (bent and unbent) should be in the range from 0.5 to 2 mm. The bending angle of the leads from the plane of the board should be from 0° to 45°.
If it is impossible to trim the leads, the maximum permissible height of the protruding ends of the leads should be indicated on the drawing of the printed circuit assembly.
3. REQUIREMENTS FOR FORMING TERMS AND INSTALLING ELECTRONIC PRODUCTS
PCB TECHNICIANS
3.1. The minimum installation size / y in millimeters for IET versions 1, 4-6, 14-16 (Fig. 2) should be calculated using the formula
/ y = L + 2/ 0 + 2 R + d, (1)
where L is the maximum body length, mm;
/ 0 - minimum size up to the point where the lead is bent, mm;
R - terminal bending radius, mm; d - nominal diameter of the IET output, mm.
The installation dimensions of IET versions 1, 4-6, 14-16 depending on the length of the IET body are given in Table. 2 and 3.
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Dimensions, mm table 2 |
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Dimensions, mm
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Table 3 |
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Continuation of the table. 3 Dimensions, mm |
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3.2. Installation of IET versions 1, 4-6 should be carried out close to the printed circuit board, installation of IET versions 14-16 - with a gap of 1 +0 '5 mm. 3.3. Minimum installation dimensions L in millimeters for |
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IET version 22 (Fig. 3) should be calculated according to the formula
where D is the maximum diameter (thickness) of the body, mm; d - maximum outlet diameter, mm.
Molding dimensions I in millimeters should be calculated using the formula
l=l 0 + R + ~. (3)
Dimensions for forming leads and installing IET version 22 in Drawing. 3 dependences on the diameter (thickness) of the IET housing are given in Table. 4.
3.4. Installation of IET version 22 should be carried out with a gap of at least 1 mm.
3.5. The minimum molding dimensions / in millimeters for IET versions 7, 10, 11, 13 (Fig. 4) should be calculated using the formula
/ = L + 2/ 0 + 21 K, (4)
where 1 K is the constant unified length of the molded part of the outlet, mm.
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Dimensions, mm_Table 4 |
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The constant unified length of the molded part of the 1 K lead in millimeters should be calculated using the formula
l K = 2R + d+ K+ 0.1, (5)
where K is the horizontal part of the molded terminal adjacent to the installation site, mm (K min = 1);
0.1 - guaranteed clearance in the die, mm.
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Installation dimensions |
The dimensions of molding and installation of IET versions 7, 10, 11, 13, depending on the length of the IET body and the diameter of the outlet, are given in Table. 5, 6, 7.
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Table 5 Dimensions of molding and installation of IET versions 7, 10, 11, 13 with lead diameters up to 0.5 mm Dimensions, mm |
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Table 6
Dimensions of molding and installation of IET versions 7, 10, 11, 13 with lead diameters over 0.5 to 1 mm
Dimensions, mm
resistor, capacitor
Case length L
Molding Dimensions
semiconductor
throttle
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Table 7 |
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Dimensions of molding and installation of IET versions 7, 10, 11, 13 with lead diameters over 1 mm Dimensions, mm |
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с ^ о К к Ф o,S |
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The molding depth of the leads H in millimeters for IET versions 7, 10 should be calculated using formula (6) and selected from the following series: 0.4; 0.6; 0.8; 1.0; 1.2; 1.4; 1.6; 1.8; 2.0; 2.2; 2.4; 2.6; 2.8; 3.0; 3.2; 3.4; 3.6; 3.8; 4.0; 4.2; 4.4; 4.6; 4.8; 5.0; 5.2; 5.4; 5.6; 5.8; 6.0; 6.2; 6.4; 6.6; 6.8; 7.0; 7.2; 7.4; 7.6; 7.8; 8.0 mm.
The molding depth H for IET versions 11, 13 is determined by the thickness of the body and is selected from the specified range.
The tolerance for the molding depth should be taken equal to minus 0.2 mm.
3.7. Installation of IET versions 7, 10, 11, 13 should be carried out close to the printed circuit board, with a gap of up to 0.3 mm allowed.
3.8. The molding and installation dimensions for IET version 12 are shown in Fig. 5.
3.9. Installation of IET version 12 should be carried out with a gap provided by the molding of the leads.
3.10. The molding dimensions for IET version 17 are shown in Fig. 6.
3.11. Installation of IET version 17 should be carried out with a gap of 3 +0 5 mm.
3.12. Installation dimensions for IET versions 2, 3, 8, 9, 18-21 should be selected in accordance with the pin spacing according to the specifications.
When delivering IET of the specified versions with maximum deviations from the nominal size between the terminals, it is allowed to preform the terminals to the installation size.
Installation dimensions
3.13. Forming of IET outputs of versions 2, 3 should be carried out in accordance with the drawing. 7.
Molding dimensions / for IET versions 2, 3 should be calculated using formula (3) and selected according to table. 4.
3.14. The formation of IET outputs of versions 8, 9 should be carried out in accordance with the drawings. 8 and table. 9.
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Table 9 Dimensions, mm |
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Forming and cutting leads of radio elements
Devices for forming leads of radioelements. When installing electronic equipment units, various types of mounted radio elements (transistors, resistors, diodes, etc.) are most widely used. Depending on the nature of production, installation of mounted radio circuit elements on printed circuit boards is carried out manually or mechanized. Mounted radio elements are installed on printed circuit boards after preliminary bending of their leads in accordance with the distances between the ring ends of the printed conductors. In single and small-scale production, bending of the leads of radio elements is in most cases carried out according to a template or locally using an installation tool. The arrangement of parts on the board may vary depending on the pin bending configuration.
The simplest and most commonly used form of lead bending is U-shaped. This forming can be conveniently performed using the tabletop device of the innovator V.D. Krasavin.
The device consists of the following main components and parts: body, adjusting screw, matrix, bending mechanism and lever. The adjusting screw allows the device to be adjusted to different sizes of radio element arms.
The molding of the radio element leads is carried out as follows: the force applied to the lever is transmitted to the bending mechanism, which, in turn, through spring-loaded inserts, acts on the clamp levers designed to stabilize the radio element leads located in the installation grooves of the device matrix. Such a connection is necessary so that after pressing the leads in the installation grooves, the bending mechanism (punches) continues to move and forms the configuration of the leads. The device allows you to improve the quality of lead molding and eliminate the need to manufacture devices for each standard size of radio element.
Innovators A.M. Mishin and N.K. Rogov developed an automatic machine for molding radioelements with axial leads (resistors, capacitors, diodes). The molding of the terminals of radio elements is carried out in the form of a U-shaped straight form and a U-shaped with a bend.
When molding, the machine is connected to a 220V network, then the catchers are installed at a certain distance and radio elements with axial leads are inserted into the guide catchers.
To bring the machine into working condition, it is turned on, and the radio element moves along the bevel of the catchers. Using the laying mechanism, elements are fed from the plate to the matrix and the forming punch. The punch, moving, forms the terminals of the radio element. As soon as the leads are finally formed, the punch unlocks the matrix, clearing the way for the movement of the radio element, and the radio element falls into the receiving device. The next element is then inserted and the molding process is repeated.
The introduction of an automatic machine allows you to increase labor productivity several times.
The machine of innovators E. S. Ivanov and M. A. Lutsky is designed for preparing radial and tape leads of resistances of type BC and ULM for installation. The process of preparing for installation consists of the following operations: straightening and preliminary trimming, firing of paint, removing paint, fluxing, maintenance and shaping of the rig and trim to size.
Rice. 1. Device for forming leads of radioelements.
The machine consists of a base, a drive, a camshaft with mechanisms, a loading mechanism, a carriage with a cassette, feeding mechanisms, straightening and pre-cutting, firing and paint removal units,
Rice. 2. Automatic machine for forming leads of radio elements.
fluxing and tinning, creasing and cutting to size. The machine is loaded using cassettes with a capacity of 200 elements. For elements supplied in cardboard containers and arranged in parallel rows, there is a special cassette into which the container is installed. For elements arriving in bulk, there is a cassette that imitates containers. The selection of elements into the cassette is carried out manually.
The prepared cassette is installed in special grooves of the carriage until it stops. In this case, the carriage must be in its original position. After turning on the machine, the grippers of the loading mechanism approach the carriage, grab one row of elements in the cassette, pull them out and feed them into the process flow, which is a slot formed by two guide plates. After picking up a number of elements, the carriage moves into a step, bringing the next row of elements to the picking position.
A full cycle of the loading mechanism is carried out in eight revolutions of the main camshaft. The comb of the feed mechanism, after leaving the first element of the fed row, moves the remaining elements by a step of 12 mm, feeding the next element. The hearth mechanism transfers elements to position in 80 mm increments. In working positions, the elements are pressed against the guides by flat springs to prevent them from jumping out under the influence of the working elements. After the elements are fed per step, all working mechanisms that process the outputs move to the upper position, in which they perform the corresponding technological operations in each working position.
After the last element leaves the loading zone, the loading mechanism feeds the next one into the technological rotor. a number of elements. The supply of elements along the flow occurs uninterruptedly until the end of the elements in the cassette. Upon completion of the elements in the cassette, automatic stopping of the machine can be accomplished in two ways. In the case of preparing elements of the same denomination, a stop can be made after taking the last row from the cassette and feeding it into the process flow. In this case, an uninterrupted supply of elements is achieved after changing the cassette and starting the machine. The performance of the machine is maximum. In the case of preparing elements of different ratings, the stop occurs after the last element leaves the process flow into the receiving container. This is necessary to prevent misalignment of different denominations. After the machine stops, the carriage is reloaded. Recharging and starting time is a few seconds.
Rice. 3. A device for cutting micromodule leads.
Labor productivity increases by 2.5 times when introducing an automatic machine.
A device for cutting micromodule leads. Innovators R. M. Osipov, V. V. Vasiliev and V. V. Chistok developed a device for cutting micromodule leads (Fig. 3). It consists of a base on which holes are drilled for micromodule leads, a bracket with a screw for fastening the device in the workplace, a knife made of carbon tool steel, a guide bracket, a knife stop, a spring for returning the knife to its original position and a receiving device for cutting conclusions. This device allows you to simultaneously cut the leads of micromodules to a given length, while labor productivity increases by 2 times compared to the manual method.
TO Category: - Tools for electrical installation work